What do you get when you mash together a community site, a blog platform, Twitter feeds, a Facebook fan page, multimedia press kits, loads of video and hi-res photography, plus nearly two decades of searchable historic news content into one website? You get a highly versatile toolbox of online tools to help you navigate and support ever-expanding audiences in a rapidly changing PR world. Today we open up our new toolbox, the Intel Newsroom.

Intel and Micron are sampling their first 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process technology, producing the industry’s highest capacity, smallest NAND chip. The 8GB device offers improved cost efficiencies and higher storage capacity for the competitive USB, SD (Secure Digital) flash card and consumer electronics markets. Flash memory is primarily used to store data, photos or other multimedia for use in capturing and transferring data between computing and digital devices.

Companies Announce Industry’s Highest Capacity, Smallest NAND Device Providing Cost Advantages for a Wide Range of Consumer Storage Applications

 

 

SANTA CLARA, Calif. and BOISE, Idaho, Aug. 17, 2010 – Intel Corporation and Micron Technology Inc. today announced the delivery of 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process technology, producing the industry’s highest capacity, smallest NAND device. The companies have sent initial product samples to select customers. Intel and Micron expect to be in full production by the end of the year.

 

The new 64-gigabit (Gb) 3bpc on 25nm memory device offers improved cost efficiencies and higher storage capacity for the competitive USB, SD (Secure Digital) flash card and consumer electronics markets. Flash memory is primarily used to store data, photos and other multimedia for use in capturing and transferring data between computing and digital devices such as digital cameras, portable media players, digital camcorders and all types of personal computers. These markets are under constant pressure to provide higher capacities at low prices.

 

Designed by the IM Flash Technologies (IMFT) NAND flash joint venture, the 64-Gb, or 8 gigabyte (GB), 25nm lithography stores three bits of information per cell, rather than the traditional one bit (single-level cell) or two bits (multi-level cell). The industry also refers to 3bpc as triple-level cell (TLC.)

 

The device is more than 20 percent smaller than the same capacity of Intel and Micron’s 25nm MLC, which is currently the smallest single 8GB device in production today. Small form-factor flash memory is especially important for consumer end-product flash cards given their intrinsic compact design. The die measures 131mm² and comes in an industry-standard TSOP package.

 

“With January’s introduction of the industry’s smallest die size at 25nm, quickly followed by the move to 3-bit-per-cell on 25nm, we continue to gain momentum and offer customers a compelling set of leadership products,” said Tom Rampone, Intel vice president and general manager of Intel NAND Solutions Group. “Intel plans to use the design and manufacturing leadership of IMFT to deliver higher-density, cost-competitive products to our customers based on the new 8GB TLC 25nm NAND device.”

 

“As the role of NAND memory continues to escalate in consumer electronics products, we see the early transition to TLC on 25nm as a competitive edge in our growing portfolio of NAND memory products,” said Brian Shirley, vice president of Micron’s NAND Solutions Group. “We are already working to qualify the 8GB TLC NAND flash device within end-product designs, including higher-capacity products from Lexar Media and Micron.”

 

Relevant Links

There are other ways to stay up-to-date on Micron and Intel news:

• Micron Innovations Blog: www.micronblogs.com
  
• Micron on Twitter: http://twitter.com/microntechpr
  
• Intel NAND Flash: www.intel.com/design/flash/nand
  
• Intel Blog: blogs.intel.com
  
• Intel on Twitter: http://twitter.com/intelnews
  
• Intel Communities: communities.intel.com
  

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

About Micron
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

 

©2010 Micron Technology, Inc. and Intel Corporation. All rights reserved. Information is subject to change without notice.

 

Micron and the Micron logo are trademarks of Micron Technology, Inc.

 

Intel is a trademark of Intel Corporation in the United States and other countries. All other names and brands may be claimed as the property of others.

 

This press release contains forward-looking statements regarding the production of the 3bpc 64Gb NAND device. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

Intel and the Defense Advanced Research Projects Agency (DARPA), part of the U.S. Department of Defense, have entered into a multi-year, $49 million technology investment agreement to prototype revolutionary hardware and software technologies for extreme-scale computing systems as part of DARPA's Ubiquitous High Performance Computing (UHPC) program. For details on the Intel-lead collaborative research program, see Intel CTO Justin Rattner's blog.

Mike Mestrovich, senior technology officer for innovation at the Defense Intelligence Agency (DIA), says DIA will move to desktop virtualization based on Citrix Xen, Intel vPro and Microsoft technologies.  Mestrovich told InformationWeek that a pilot program showed that desktop virtualization will both improve security and reduce the cost of managing DIA’s desktops. Unlike earlier thin-client technology, DIA’s desktop virtualization infrastructure can handle graphically demanding applications for DIA employees, Mestrovich told Federal Computer Week.

 

SANTA CLARA, Calif., Aug. 16, 2010 – Intel Corporation today announced it has signed an agreement to acquire Texas Instruments' cable modem product line. The purchase enhances Intel's focus on the cable industry and related consumer electronics (CE) market segments, where the company's expertise in building advanced system-on-chip (SoC) products, based on Intel® Atom™ processors, will be applied.

 

Intel plans to combine Texas Instruments' best-of-breed Puma product lines with the Data Over Cable Service Interface Specification (DOCSIS) standard technology and Intel SoCs to deliver advanced set top box, residential gateway and modem products for the cable industry. The objective is to provide cable OEMs with an open and powerful platform for delivering innovative and differentiated products to service providers that improve the video, voice and data content experience at home.

 

"Adding the talents of the Texas Instruments' cable team to Intel's efforts to bring its advanced technology to consumer electronics makes for a compelling combination," said Bob Ferreira, general manager, Cable Segment, Intel's Digital Home Group. "Intel is focused on delivering SoCs that provide the foundation for consumer electronics devices such as set top boxes, digital TVs, Blu-ray* disc players, companion boxes and related devices. This acquisition specifically strengthens Intel's product offerings for the continuum of cable gateway products and reinforces Intel's continued commitment to the cable industry."

 

All employees of Texas Instruments' cable modem team received offers to join Intel at sites in their home countries, primarily Israel, and will become part of Intel's Digital Home Group. Additional terms of the transaction were not disclosed. The agreement is subject to regulatory review and customary closing conditions. It is expected to close in the fourth quarter of 2010.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.

News Highlights

• Intel is introducing an update to the Intel® Atom™ processor-based platform for home and small business storage appliances that boosts processor speed and supports a new memory technology.
  
• Intel Atom processors optimized for networked storage appliances in the home and small businesses have gained industry support from major storage manufacturers since its launch earlier this year.
  
• Leading storage vendors Acer*, Cisco*, LaCie*, LG Electronics*, NETGEAR*, QNAP*, Super Micro*, Synology* and Thecus* have adopted the Intel Atom processor-based platform into products that are available now.
  

 

 

SANTA CLARA, Calif., Aug. 16, 2010 – Backed by industry support of the Intel® Atom™ processor optimized for networked storage appliances for the home and small business, Intel Corporation has added two new Intel Atom processors to further boost the company’s focus on the platform.

 

Since Intel’s initial foray in this area in March, leading storage manufacturers, including Acer*, Cisco*, LaCie*, LG Electronics*, NETGEAR*, QNAP*, Super Micro*, Synology* and Thecus* have announced products based on the energy-efficient Intel Atom processor platform.

 

Broadening its offerings for consumer and small business storage appliances, Intel is introducing the 1.8GHz Intel Atom processor D425 single-core and D525 dual-core. These processors boost performance with higher CPU frequencies for faster storage processing and will support the new memory technology, double-data-rate three small outline dual in-line memory modules, also known as DDR3 SODIMM.

 

The new Intel Atom processors (D425 and D525) are paired with the Intel® 82801 IR I/O Controller that delivers the input/output (I/O) connectivity to satisfy the growing throughput demands of leading storage vendors. Both additions to the storage platform offer the flexibility to support Microsoft Windows Home Server* and open source Linux operating systems.

 

“Networked storage appliances based on the Intel Atom processor platform enable consumers and businesses to organize, manage, protect and share documents, photos, videos and music throughout the home or office,” said Dinesh Rao, product line manager, Intel Storage Group. “The versatile Atom processor, which is at the heart of a growing variety of small, innovative, Internet-connected devices, makes it possible for storage vendors to develop low-power appliances that can innocuously sit on a desk or shelf while keeping digital content safe and available anytime, anywhere.”

 

Since March, storage manufacturers have adopted the Intel Atom processor D410 single-core and D510 dual-core, each paired with the Intel 82801 IR I/O Controller, to power these affordable network-attached storage (NAS) appliances for the home and small business. Storage vendor products featuring the Intel Atom processor-based platform are currently available and additional devices will be released later this year.

 

“LaCie recently introduced two storage servers that leverage Intel’s Atom processor technology to deliver enterprise-level storage capabilities to small and medium businesses that were previously only experienced in large, corporate environments,” said Erwan Girard, LaCie Solutions business unit manager. “The new servers include the perfect mix of corporate-grade features and intuitive management software, enclosed in an award-winning 5big design for your desktop, allowing these products to fit seamlessly into any business environment.”

 

The updated Intel Atom processors for consumer and small business NAS appliances are currently shipping. Additional information is available at intel.com/go/storage.

 

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

 

Intel is a trademark of Intel Corporation in the United States and other countries.

 

* Other names and brands may be claimed as the property of others.